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Direct pull tension testing with the Hysitron PI 89 SEM PicoIndenter - A primer

Bruker Nano Surfaces and Metrology
23 Jul 2023

The tensile test is the most ubiquitous method for macroscale mechanical characterization of materials. This is because it provides a full stress strain curve, allowing analysis of such important material properties as yield strength, ultimate strength, elastic limit, and work hardening rates. In-situ nanomechanical testing is a powerful family of techniques that allow for real-time observation of deformation mechanisms that are directly correlated to load-displacement data.

The combination of these techniques with high-resolution electron microscopy and its related chemical and structural analysis techniques can provide incredibly detailed data. In this application note, Bruker Nano discusses using the Hysitron® PI 89 SEM PicoIndenter® and Tribo iQ™ application for direct pull tension within an SEM application, including the steps required for tip and sample fabrication, tip alignment, and data analysis.

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Hysitron PI 89

Bruker Nano Surfaces and Metrology

The Hysitron PI 89 SEM PicoIndenter leverages the advanced imaging capabilities of scanning electron microscopes (SEM, FIBSEM, PFIB), making it possible to perform quantitative nanomechanical testing while simultaneously imaging. Enabled testing techniques include nanoindentation, tensile testing, pillar compression, particle compression, cantilever bending, fracture, fatigue, dynamic testing, and mechanical properties mapping.

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Non-Destructive TechniquesNon-destructive techniques (NDT) describes a variety of analytical techniques used to evaluate the properties of a material. Common methods include ultrasonic, magnetic-particle, liquid penetrant, radiographic, remote visual inspection (RVI), and eddy-current testing. NDT is regularly used in forensic engineering, civil engineering, mechanical engineering, electrical engineering, systems engineering, aeronautical engineering, and medicine.ProfilometersProfilometers are instruments used to measure a surface's profile, in order to quantify etch depth, deposited film thickness, and surface roughness. They operate in either contact or non-contact modes and may use optical or stylus techniques to make the actual measurements.Electron MicroscopyElectron microscopes (EM) are used to create high-resolution images of samples at the nanoscale by means of an accelerated beam of electrons as a source of illumination. Types of electron microscope include scanning electron microscopes (SEM), transmission electron microscopes (TEM), scanning transmission electron microscopes (STEM) and cryo-electron microscopes. Focused ion beam (FIB) microscopes are useful for modifying or milling a sample surface with nanometer precision, as well as imaging. Find the best electron microscopes in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.MicroscopyMicroscopy is a technique used to observe small objects in detail, from cells to materials, using light or electron microscopes. It enables researchers to examine structures with high resolution, aiding in fields such as biology, medicine, and materials science. With advanced microscopy techniques, scientists can gain insights into cellular processes, tissue structures, and material properties. Explore the best microscopy solutions in our peer-reviewed product directory, compare products, read customer reviews, and get pricing directly from manufacturers.SEMScanning Electron Microscopy (SEM) is a technique that uses a focused electron beam to scan a sample and create high-resolution images. It is widely used in materials science, nanotechnology, and biological research. Explore SEM systems in our peer-reviewed product directory; compare products, check reviews, and get pricing directly from manufacturers.

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Direct pull tension testing with the Hysitron PI 89 SEM PicoIndenter - A primer