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Curing of an Optical Adhesive by UV Irradiation in the DSC 8000
21 Nov 2012Optical adhesives are used in many industries where solvents are undesirable, for example in the manufacturing of semiconductors. The use of photo-DSC allows the fast analysis of the curing profile and measurement of the energy of the curing reactions. This application note from PerkinElmer demonstrates the capabilities of photo-DSC for studying and characterizing optically curing materials.
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CalorimetryCalorimetry is a technique used to determine the heat released or absorbed in a chemical reaction. Calorimeters can be categorized into bomb calorimeters, constant pressure calorimeters, differential scanning calorimeters, isothermal titration calorimeters, X-ray microcalorimeters, heat-loss calorimeters, and high-energy particle calorimeters. The choice of calorimeter depends on the application.Thermal Analysis EquipmentThermal analysis equipment is used for measuring heat flow, weight loss, dimension changes or thermomechanical properties and is important for analyzing a material’s performance and stability. Thermal analysis equipment includes differential scanning calorimeters (DSC), thermogravimetric analyzers (TGA), thermomechanical analyzers (TMA), dilatometers, thermometers, vapor sorption analyzers, boiling and melting point apparatus. Thermal analyzers can reveal properties such as melting, crystallization and glass transitions or other processes such as oxidation, decomposition, volatilization, as well as coefficients of thermal expansion and modulus. Find the best thermal analysis equipment in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.SemiconductorsDifferential Scanning Calorimetry