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Characterization of Electronic Materials Using Thermal Analysis
20 May 2012Thermal analysis comprises a series of powerful techniques for the characterization of the thermal, physical, mechanical and degradation properties of materials. This note presents the application of thermal analysis for the characterization of electronic materials and components, including printed circuit boards (PCB) and encapsulants.
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Thermal Analysis EquipmentThermal analysis equipment is used for measuring heat flow, weight loss, dimension changes or thermomechanical properties and is important for analyzing a material’s performance and stability. Thermal analysis equipment includes differential scanning calorimeters (DSC), thermogravimetric analyzers (TGA), thermomechanical analyzers (TMA), dilatometers, thermometers, vapor sorption analyzers, boiling and melting point apparatus. Thermal analyzers can reveal properties such as melting, crystallization and glass transitions or other processes such as oxidation, decomposition, volatilization, as well as coefficients of thermal expansion and modulus. Find the best thermal analysis equipment in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.Differential Scanning CalorimetryThermogravimetric Analysis

