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Better Characterization of Hot Melt Adhesives Using the Double Furnace DSC
3 May 2012In order to demonstrate the use of the Double Furnace DSC for the better and more complete characterization of hot melt adhesives, a two stage adhesive was analyzed. The ability to perform rapid cooling experiments on the hot melt adhesives is important. The Double Furnace DSC is shown to provide the very fast response times necessary to be able to perform these high velocity measurements.
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Thermal Analysis EquipmentThermal analysis equipment is used for measuring heat flow, weight loss, dimension changes or thermomechanical properties and is important for analyzing a material’s performance and stability. Thermal analysis equipment includes differential scanning calorimeters (DSC), thermogravimetric analyzers (TGA), thermomechanical analyzers (TMA), dilatometers, thermometers, vapor sorption analyzers, boiling and melting point apparatus. Thermal analyzers can reveal properties such as melting, crystallization and glass transitions or other processes such as oxidation, decomposition, volatilization, as well as coefficients of thermal expansion and modulus. Find the best thermal analysis equipment in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.Hot Melt AdhesivesDouble Furnace DSC