ResourceSpectroscopy
Application of PIPS II System for Cross-sectional TEM Specimen Preparation of Semiconductor Devices
Application of PIPS II System for Cross-sectional TEM Specimen Preparation of Semiconductor Devices
8 Jan 2016This application note demonstrates the application of the PIPS II system for the cross-sectional specimen preparation for transmission electron microscopy (TEM) has been developed during the recent years, mainly applied to thin film stacks of solar-cell devices. This approach consists of mechanical and argon (Ar) ion polishing of cross-section specimens, formed by face to face gluing of two thin film stacks using epoxy glue. This allows structural properties of individual layers and their interfaces can be analyzed at high resolution.
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Sample PreparationSample preparation can improve the quality and speed of separation techniques. Products to assist sample preparation include filtration equipment, evaporators, membranes and sieves.Particle CharacterizationParticle characterization instruments are used to determine particle size distribution, shape, surface area, zeta potential, density and porosity of particles and materials. Multiple tecchniques are available for determining particle size, shape and count including dynamic light scattering (DLS), laser diffraction, electrozone (Coulter technique), imaging particle analysis and single particle optical sensing. Determine the density of your material with a gas pycnometer or examine its surface area and porosity with gas adsorption analyzers and mercury porosimeters. Find the best particle characterization instruments in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.Mechanical TestingMechanical testing explores the elastic and inelastic nature of a material when force is applied. A mechanical test shows whether a material is suitable for its intended application by measuring hardness, tensile strength, elongation, elasticity, and fatigue limit.Non-Destructive TechniquesNon-destructive techniques (NDT) describes a variety of analytical techniques used to evaluate the properties of a material. Common methods include ultrasonic, magnetic-particle, liquid penetrant, radiographic, remote visual inspection (RVI), and eddy-current testing. NDT is regularly used in forensic engineering, civil engineering, mechanical engineering, electrical engineering, systems engineering, aeronautical engineering, and medicine.Electron MicroscopyElectron microscopes (EM) are used to create high-resolution images of samples at the nanoscale by means of an accelerated beam of electrons as a source of illumination. Types of electron microscope include scanning electron microscopes (SEM), transmission electron microscopes (TEM), scanning transmission electron microscopes (STEM) and cryo-electron microscopes. Focused ion beam (FIB) microscopes are useful for modifying or milling a sample surface with nanometer precision, as well as imaging. Find the best electron microscopes in our peer-reviewed product directory: compare products, check customer reviews and receive pricing direct from manufacturers.SemiconductorsTEMSolar Energy