PE-75 Plasma Asher
A great value solution for plasma ashing semiconductor wafers
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Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.
The PE-75 is a feature packed, low cost, and robust machine that is a great choice for production facilities, research labs, universities, medical facilities, or any industry which needs a small-scale, cost-effective plasma ashing solution. It has all the features of the PE-50 XL but also features a larger chamber size for larger processing applications.
This unit excels at plasma cleaning and surface modification as well as use as a plasma asher.
The PE-75 may also be used in preparing asbestos specimens as a low temperature plasma treatment.
