Products & ReviewLife Sciences
Helios™ 5 Laser PFIB
Thermo Fisher ScientificAvailable: Worldwide
This system delivers unmatched capabilities for extreme large-volume 3D analysis, Ga-free sample preparation, and precise micromachining. Featuring an innovative, fully integrated femtosecond laser, it offers the fastest material removal rate with the highest cut face quality.
Helios™ 5 Laser PFIB
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Description
Amazing Features, Awesome Things!
- Fastest material removal for millimeter-scale cross sections with a material removal rate up to 15,000x faster than a typical Ga + FIB
- Statistically relevant subsurface and 3D data analysis by acquiring much larger volumes within a shorter amount of time
- Accurate and repeatable cut placement with triple beamcoincidence on the sample
- Fast characterization of deep subsurface features via extraction of subsurface TEM lamella or chunks for 3D analysis
- High-throughput processing of challenging materials such as non-conductive or ion beam-sensitive
- Fast and easy characterization of air-sensitive samples without the need to transfer samples between different instruments for imaging and cross-sectioning
- All capabilities of proven Helios 5 PFIB platform, including highest quality Ga-free TEM and APT sample preparation and extreme high-resolution imaging capabilities
